Day Inspection Results
Ship your product overnight and get
test results the following day.
and uBGA solder inspection
circuit and flip chip
bonding in semi-conductors
Our state-of-the-art inspection system takes
the guesswork out of process control with features that include Windows XP
based software and collision free sample movement, thereby eliminating any
chance of operator error. Our system utilizes digital imaging so if
instant feedback is required, we can email the results directly to your
in-box. If not, we can record the images on a CD and mail them to you when
we return your sample.