Real time X-Ray inspection provides
a non-destructive technique to analyze complex structures of varying
densities. Internal inspection of a sample can be performed with
submicron defect recognition at the highest magnification (5450X) and
resolution. Samples can be viewed from 0 – 45 degree angle with
capability to view 360 degrees around any position over entire
inspection area.
Quick turn BGA rework service.
Your circuit
boards can be reworked, X Ray inspected and shipped within 24 hours of
receipt.
System inspection can provide:
System Capabilities:
- State
of the Art Image Inspection
- Submicron
spot size
- Automatic
void identification and measurement software
- System
magnification up to 5450X
- Digital
Imaging in multiple formats
- Oblique
angle view 0 – 70 degrees
- Inspection
area 18” X 16“